DS8000 Service Documentation Version 7.5

Exchange the CEC enclosure processor module

Before you begin

Icon for electrostatic discharge wrist strap Use approved ESD procedures to prevent damage.

Attention:

This is not a stand-alone procedure. Customer disruption and damage to the hardware might occur if microcode and power boundaries are not in the proper conditions for this service action.
If you were sent here by a serviceable event FRU repair, the microcode and power boundaries have already been set.
If you were not sent here by a serviceable event FRU repair, see MAP1230 Replace a FRU without using a serviceable event.

Notes:

All the cables and FRUs to be removed must be uniquely identified so they can be reinstalled correctly.
If an installed earthquake resistance kit prevents you from accessing this FRU, refer to MAP1600.

Remove the CEC enclosure processor module

Procedure

Use a replacement part with a valid DS8000® part number to ensure it has the proper firmware, VPD, and/or configuration to ensure it is compatible with the DS8000 service procedures. Attempting to use a generic POWER7® server FRU might fail and require next level of support to recover.
Attention: Before continuing with this procedure, confirm you have the correct processor module (part number and CCIN) for this configuration. Attempting repair with the incorrect module will result in an invalid configuration and extended repair.
All parts being removed must be marked or identified so they can be installed into their original locations.
Note: Failure to do this can extend the service duration and may require next level of support assistance.
Move the management console laptop from the service position to the DC-UPS service position , as shown in Figure 1. Refer to Management console service positions (Model 961).
Figure 1. Alternate service position
Push the now empty management console tray fully into the rack. See Figure 1. This allows access to the top and rear of the CEC enclosure.
Use the CEC enclosure front and rear blue identify LEDs to determine the CEC enclosure to be repaired. Both blue LEDs should be solidly lit.
- CEC control panel blue identify LED , as shown in Figure 2
- CEC enclosure rear blue identify LED , as shown in Figure 3
Note: If both the front and rear CEC enclosure identify LEDs are not lit, use the location code listed in the serviceable event FRU list. See MAP1245 Finding FRUs by using location codes.

Figure 2. CEC enclosure control panel assembly

Figure 3. CEC enclosure rear LED indicators
Verify the CEC enclosure is in the power-off state. See Figure 4.
1. At the rear of the CEC enclosure, view both CEC enclosure power supply DC GOOD LEDs.
2. Are both DC GOOD (output) LEDs blinking?
  - Yes, continue with the next step.
  - No, do not continue with this FRU replacement. Go to MAP4841 CEC enclosure fails to power off during service processor repair (Model 961).
Figure 4. CEC enclosure power supply LEDs (Model 961)
Disconnect the power cables (E1-J1 and E2-J1) from the CEC with the DC Good LEDs blinking. See Figure 5.
Note: The CEC enclosure power supply LEDs continue to blink for up to 20 seconds while internal power is discharged.
1. Each power cable is looped once around the CEC enclosure power supply handle and secured with a cable tie.
2. Remove the cable tie, unplug the cable and unwrap it from the handle.
Figure 5. Location codes for the CEC enclosure (rear view) (Model 961)
Observe the CEC enclosure control panel green power present icon . See Figure 6.
- If it is off, go to the next step.
- If it is slow blinking, the CEC enclosure is still in the power-off state. DO NOT CONTINUE. Ensure that you have unplugged the power cables.
Figure 6. CEC enclosure control panel
At the front of the CEC enclosure, remove the two screws (if present) that secure the CEC enclosure to the rack. See Figure 7.
Figure 7. Preparing the CEC enclosure for service position
Pull the CEC enclosure fully out to the service position.
1. Hold the CEC enclosure release latches down on both the left and right sides, and pull the CEC enclosure full out. See Figure 8.
2. Ensure both slide rails both latch in the full out position.
Figure 8. Pulling the CEC enclosure out to the service position
Remove the CEC enclosure service access cover. See Figure 9.
1. Loosen the two thumbscrews located at the back of the cover.
2. Slide the cover toward the back of the CEC enclosure. When the front of the service access cover has cleared the upper frame ledge, lift the cover up and off the CEC enclosure.
Figure 9. Removing the service access cover
Locate the processor module tool kit. It should be in the carton received with the new processor module. See Figure 10.
Figure 10. Processor module tool kit
Locate the CEC enclosure processor module, P1-C10 or P1-C11. See Figure 11.
Figure 11. CEC enclosure location codes (top) (Model 961)
Remove the processor heat sink. See Figure 12.
1. Guide the hex driver tool down into the heat sink and engage it in the actuation screw. The top of the screw is rounded, so getting the tool into the hex hole can take some time.
2. Loosen the heat sink actuation screw by turning the hex driver (supplied) counterclockwise . The screw will break free with a noise, so be ready for that.
3. Loosen the screw until the load frame arms are disengaged from the heat sink.
4. Grip the heat sink by the grooves on opposing sides and remove the heat sink by lifting upwards. Set the heat sink aside with the module side facing upward.
  Note: If you plan to remove dust or debris from the heat sink, this operation must be performed in another room that is more than 7.6 m (meter) away from the work area.
Figure 12. Removing the heat sink
Clean any dust around the processor module using an air bulb. You must wait for any dust to settle before moving to the next step. See Figure 13.
Figure 13. Dusting the processor area
Remove the processor module. See Figure 14.
1. Press and hold the vacuum pen button and place it in the center of the processor module, then release the vacuum pen button. Releasing the vacuum pen button creates suction.
2. Remove the processor module by lifting upward.
3. While gripping the processor module by the sides, release the vacuum from the pen by pushing the button . Place the processor module lid-side (aluminum side) down on your static-free work surface.
  Note: Inspect the processor socket for debris. If debris is present, use the air pump to gently clean from the center and move outward. Do not touch the processor socket with your fingers, a brush, or the end of the air pump.
Figure 14. Removing the system processor modules

Install the CEC enclosure processor module

Procedure

Install the processor module.
1. Press and hold the vacuum pen button and place it in the center of the processor module, then release the vacuum pen button. Releasing the vacuum pen button creates suction. Lift the processor module up. See Figure 15.
  Figure 15. Removing the system processor modules from the packaging
2. Inspect the bottom of the processor module for any visible damage or debris. If debris is present, you can use the air pump to remove it. See Figure 16.
  Note: Do not touch or use a brush on the processor module.
  
  Figure 16. Removing debris from the system processor modules
3. Lower the system processor modules on to the board using the two keyed notches on the processor module and two keyed corners on the processor socket for alignment. Release the vacuum from the pen by pushing the button . See Figure 17.
  Figure 17. Installing the system processor modules
4. Ensure that the processor module is fully seated by pressing firmly with your finger.
Inspect the thermal interface material (TIM) for damage. The expectation is that when the heat sink is removed from the failed processor module, the TIM is attached to the heat sink. Unless damaged, the TIM attached to the heat sink can be reused. See Figure 18.
Note: Replacing the TIM is optional and is only performed when there is damage. Do not reuse the removed heat sink with TIM if it has damage. Either discard the heat sink and damaged TIM locally or return to IBM® based on part-order-form part status.

Figure 18. Inspecting the thermal interface material
If damaged, replace the thermal interface material (TIM) and heat sink. See Figure 19.
1. If TIM or heat sink replacement is necessary, order part number 74Y7420, Heat sink and Indium (TIM).
2. Remove the clear film from the thermal interface material packaging.
  Note: The thermal interface material must remain flat. Small wrinkles are acceptable, but folds are not acceptable.
3. Lightly grip the thermal interface material by the edges and center it on to the processor module with the red stripe facing up.
Figure 19. Installing the TIM onto the processor lid
Install the heat sink.
1. With the heat sink outside the CEC enclosure, insert the hex driver tool into the heat sink center load screw. This is easy because you can see the tool and screw head.
2. Lower the heat sink with tool inserted onto the processor housing using the guide holes on the heat sink to align properly with the guide pins . See Figure 20.
3. When the heat sink contacts the processor housing it also contacts a lever connected to each load arm D . See Figure 20.
4. Both load arms should pivot in towards each other causing them to engage the horizontal shaft on each side of the heat sink.
5. As you continue to turn the heat sink center load screw with the load arms engaged, the heat sink is pulled firmly into contact with the top of the processor module.
  Figure 20. Installing the heat sink
6. Tighten the center load screw clockwise using the hex driver (supplied) until a firm stop is reached. The firm stop occurs when the screw reaches the bottom of the hole.
7. Hold the top of the heat sink and gently try to move it side to side. See Figure 21.
  - If the heat sink moves noticeably, then the load arms are not engaged and the processor will overheat. Unscrew the center load screw and try this step again. If it fails again, you will need to manually push the load arms in while you turn the center load screw. If you are working alone you can carefully latch one load arm at a time. If you have an assistant, they can use their fingers to push the load arms in while you tighten the load screw.
    Note: To allow access to the load arms, you might need to remove memory cards and a CEC enclosure middle fan.
  - If the heat sink does not move, continue this step.
  Figure 21. Tightening the heat sink center load screw
Install the service access cover. See Figure 9.
1. Place the service access cover on top of the system, about 25 mm (1 in.) from the upper chassis ledge.
2. Hold the service access cover against the system unit and slide it toward the front of the system. The tabs of the service access cover slide beneath the upper chassis ledge.
3. Align the two thumbscrews located on the back of the service access cover with the two holes on the back of the system chassis.
4. Tighten the thumbscrews to secure the service access cover.
Push the CEC enclosure fully into the rack until it latches in place.
If the CEC enclosure was held in place with screws, install them now.
DO NOT CONNECT the two power cables until directed.
Connect all rear cables except the two power cables. For location codes see, Figure 5.
Connect the power cables (E1-J1, E2-J1) to both CEC enclosure power supplies. See Figure 22.
Note: The power supply "DC Good" green LED should blink. See Figure 4.
1. Loop the power cable around the power supply handle and connect it.
2. Secure the cable with the cable tie.
Is the DC Good green LED blinking on one or both power supplies?
- Yes, go to the next step.
- No, ensure the power cables are properly connected. If no cable problem is found, call the next level of support.
Figure 22. CEC enclosure power supply cable loops
Wait up to 5 minutes for the CEC enclosure control panel green power present LED [B] to slow blink, as shown in Figure 2.
Note: This ensures the CEC enclosure is in the power-off state.

Is the green LED blinking?
- Yes, go to the next step.
- No, ensure the CEC enclosure power supplies are fully seated. The possible failing FRUs are the CEC enclosure system backplane, I2C interface card and cables, and control panel. You can also call the next level of support.
Return the management console laptop to the standard service position on the slide-out tray. See Figure 1.
1. Slide the empty management console tray out to the service position.
2. Move the laptop assembly from the DC-UPS service position to the standard service position . Carefully route the cable bundle.
3. Push the DC-UPS service position rails fully in.
Exit this service information center parts exchange procedure and return to the procedure that sent you here.